1 = Byte addressability, Hold pin, Micron XiP2 = Byte addressability, Hold pin, Basic XiP3 = Byte addressability, Reset pin, Micron XiP4 = Byte addressability, Reset pin, Basic XiP7 = Byte addressability; Hold pin; Micron XIP(4-byte addressing mode is the default at power-up.)8 = Byte addressability; Hold pin; Micron XIP, RESET pin
X
Operating Voltage
1 = Vcc=1.7V to 2.0V3 = Vcc=2.7V to 3.6V
X
Block Structure
B = BottomT = TopE = Uniform (no boot sectors)G = Uniform (64KB and 4KB) , easy transparent stack
XX
Package Type
F4 = U-PDFN-8 4mm x 3mm (MLP8)F6 = V-PDFN-8 6mm x 5mm (MLP8 6mm x 5mm)F7 = V-PDFN-8 6mm x 5mm Sawn (MLP8 6mm x 5mm)F8 = V-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)12 = T-PBGA-24b05 6mm x 8mm14 = T-PBGA-24b05 6mm x 8mm, 4x6 ball arraySC = SOP2-8 150 mils body width (SO8N)SE = SOP2-8 208 mils body width (SO8W)SF = SOP2-16 300 mils body width (SO16W)51 = XF-SCSP-8/2mm x 2.8mm (XFCSP)53 = XF-SCSP-8/2.93mm x 3.5mm (XFCSP)
X
Temperature And Test Flow
4 = Industrial temperature range, –40°C to 85°C,device tested with standard test flowA = Automotive temperature range, –40°C to 125°C,device tested with high reliability certified test flowH = Industrial temperature range, –40°C to 85°C,device tested with high reliability certified test flow4 = Industrial, Wireless temperature range, –25 to 85°C,device tested with standard test flow
X
Security Features
0No extra security
X
Packing Options
E = Tray packingF = Tape and reel packingG = Tube packing
Poznámka: Tabuľka popisu čísla dielu popisuje bežný systém číslovania dielov pre viac čipov, preto môže táto tabuľka obsahovať informácie, ktoré nemusia byť platné pre aktuálne vybraný čip. Tu uvedené informácie sú poskytované na základe maximálneho úsilia a môžu byť nepresné alebo neúplné. Preto vždy skontrolujte najnovší technický list čipu, kde nájdete detailný popis čísla dielu. Ak nájdete nejakú nepresnosť, dajte nám vedieť.